XIAO ESP32-C6 Pre-Soldered Development Board 160MHz RISC-V Wi-Fi 6 Bluetooth LE Zigbee Thread Matter 4MB Flash

XIAO ESP32-C6 Pre-Soldered Development Board

The XIAO ESP32-C6 is a compact wireless microcontroller development board powered by the Espressif ESP32-C6 SoC. It combines dual 32-bit RISC-V processors, 2.4GHz Wi-Fi 6, Bluetooth LE and IEEE 802.15.4 connectivity with 512KB SRAM and 4MB Flash. Pre-soldered headers and a 21 × 17.8mm form factor make it suitable for Matter smart-home devices, wireless sensors, wearables and battery-powered IoT applications.

Technical Specifications

• Product model: XIAO ESP32-C6, pre-soldered version
• Microcontroller: Espressif ESP32-C6 SoC
• Main processor: 32-bit high-performance RISC-V processor
• Main processor frequency: Up to 160MHz
• Low-power processor: 32-bit RISC-V processor operating at up to 20MHz
• SRAM: 512KB
• Flash memory: 4MB
• Wi-Fi: 2.4GHz Wi-Fi 6
• Wi-Fi standard: IEEE 802.11ax with 802.11b/g/n compatibility
• Bluetooth: Bluetooth Low Energy
• IEEE 802.15.4 protocols: Zigbee and Thread
• Smart-home protocol support: Matter through compatible software frameworks
• GPIO: 11 PWM-capable pins
• Analog inputs: 7 ADC channels
• Standard interfaces: 1 × UART, 1 × I²C and 1 × SPI
• Low-power interfaces: 1 × LP UART and 1 × LP I²C
• Additional interface: 1 × SDIO
• USB connector: USB Type-C
• Antenna: Onboard antenna
• External antenna interface: U.FL connector
• Onboard indicators: User LED and battery-charging LED
• Onboard controls: RESET button and BOOT button
• Security: Secure Boot, Flash encryption and hardware security functions
• USB Type-C input: 5V DC
• Battery input: 3.7V
• Battery management: Onboard lithium-battery charging
• Typical modem-sleep current: Approximately 30mA at 3.8V
• Typical light-sleep current: Approximately 3.1mA at 3.8V
• Typical deep-sleep current: Approximately 15μA at 3.8V
• Working temperature: -40°C to 85°C
• Dimensions: 21 × 17.8mm
• Header configuration: Pre-soldered
• Component layout: Single-sided component mounting

Dual RISC-V Processor Architecture

The ESP32-C6 combines a high-performance 32-bit RISC-V processor operating at up to 160MHz with a low-power RISC-V processor operating at up to 20MHz. This asymmetric architecture supports demanding wireless workloads while providing low-power resources for background monitoring and energy-efficient operation.

Wi-Fi 6 and Bluetooth LE Connectivity

The integrated 2.4GHz Wi-Fi 6 subsystem supports reliable network connectivity for wireless sensors, cloud-connected controllers and smart-home equipment. Bluetooth LE enables low-power communication with mobile devices, gateways and compatible peripherals.

Zigbee, Thread and Matter Development

IEEE 802.15.4 radio connectivity enables Zigbee and Thread applications. When used with compatible software frameworks, the board supports the development of interoperable Matter smart-home devices such as sensors, switches, lighting controllers and automation nodes.

Flexible Antenna Configuration

An integrated antenna supports compact installations without additional RF hardware. The U.FL connector allows connection to a compatible external antenna when flexible antenna positioning or different installation requirements are needed. Communication range depends on the antenna, environment, obstacles and RF configuration.

Low-Power Battery Design

The board accepts 5V power through USB Type-C or power from a compatible 3.7V lithium battery. Integrated battery-charge management and deep-sleep current as low as approximately 15μA under specified conditions support wearable devices, portable sensors and intermittently active IoT nodes.

GPIO and Peripheral Expansion

Eleven PWM-capable GPIOs, seven ADC channels, UART, I²C, SPI, SDIO and low-power peripheral interfaces provide flexible connectivity for sensors, displays and actuators. Pre-soldered headers allow direct breadboard and jumper-wire connections.

Typical Applications

• Matter-compatible smart-home devices
• Zigbee and Thread sensor networks
• Wi-Fi 6 IoT controllers
• Wireless environmental sensors
• Home-automation switches and lighting controls
• Battery-powered wearable electronics
• Cloud-connected monitoring equipment
• Compact embedded-system prototypes