XIAO ESP32-C3 Pre-Soldered Development Board 160MHz RISC-V Wi-Fi Bluetooth 5 LE 4MB Flash 400KB SRAM U.FL

XIAO ESP32-C3 Pre-Soldered Development Board

The XIAO ESP32-C3 is a compact, pre-soldered wireless microcontroller development board based on the ESP32-C3 SoC. It combines a 160MHz 32-bit RISC-V processor, 2.4GHz Wi-Fi, Bluetooth 5 LE, 400KB SRAM and 4MB Flash in a 21 × 17.8mm form factor. It is designed for IoT devices, wireless sensors, wearable electronics, education and low-power embedded applications.

Technical Specifications

• Product model: XIAO ESP32-C3, pre-soldered version
• Microcontroller: ESP32-C3 SoC
• Processor architecture: 32-bit RISC-V single-core processor
• Maximum clock frequency: 160MHz
• SRAM: 400KB
• Flash memory: 4MB
• Wi-Fi: 2.4GHz IEEE 802.11 b/g/n
• Bluetooth: Bluetooth 5 Low Energy
• Mesh connectivity: Bluetooth Mesh
• Digital I/O: 11 GPIOs with PWM capability
• Analog inputs: 4 ADC channels
• Communication interfaces: 1 × I²C, 1 × SPI and 1 × exposed UART
• Debug interface: JTAG pads
• Antenna interface: U.FL connector for an external antenna
• USB connector: USB Type-C
• Onboard controls: RESET button and BOOT button
• USB/VIN input: 5V DC
• Battery input: 3.7V
• Battery management: Onboard lithium-battery charging
• Charging current: Approximately 380mA fast charge and 40mA trickle charge
• Maximum specified 3.3V output current: 500mA
• Typical deep-sleep current: Approximately 44μA under specified test conditions
• Typical Wi-Fi active current: Approximately 75mA
• Typical Wi-Fi modem-sleep current: Approximately 25mA
• Typical Wi-Fi light-sleep current: Approximately 4mA
• Typical Bluetooth LE modem-sleep current: Approximately 27mA
• Typical Bluetooth LE light-sleep current: Approximately 10mA
• Software compatibility: Arduino and CircuitPython
• Working temperature: -40°C to 85°C
• Dimensions: 21 × 17.8mm
• Header configuration: Pre-soldered

RISC-V Processing for IoT Applications

The ESP32-C3 integrates a four-stage, single-core 32-bit RISC-V processor operating at up to 160MHz. Its 400KB SRAM and 4MB Flash provide resources for wireless communication, sensor acquisition, device control and embedded IoT firmware.

Wi-Fi and Bluetooth 5 LE Connectivity

The integrated 2.4GHz Wi-Fi subsystem supports station, access-point and combined operating modes. Bluetooth 5 LE and Bluetooth Mesh connectivity enable communication with mobile devices, gateways, wireless sensors and compatible smart-device networks.

External U.FL Antenna Connection

An onboard U.FL connector supports a compatible external antenna for improved wireless reception and flexible antenna placement. Communication distance depends on the selected antenna, installation, transmit settings, obstacles and local RF conditions.

Low-Power Battery Operation

The board can operate from USB/VIN power or a compatible 3.7V lithium battery. Integrated charging management and a typical deep-sleep current of approximately 44μA under specified test conditions make it suitable for portable sensors, wearables and intermittently active IoT nodes.

GPIO and Peripheral Expansion

Eleven PWM-capable GPIOs, four ADC inputs, I²C, SPI and UART interfaces support sensors, displays, actuators and communication peripherals. Pre-soldered headers allow direct connection to breadboards and compatible expansion hardware without additional header soldering.

Typical Applications

• Internet of Things devices
• Wireless environmental sensors
• Wearable and health-monitoring prototypes
• Low-power network nodes
• Smart-home controllers
• Electronics and programming education
• Rapid hardware prototyping
• Battery-powered embedded systems